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sponsored by Dell, Inc. and Intel
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Posted:
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16 Oct 2008
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Published:
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15 Oct 2008
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Format:
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PDF
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Length:
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42
Page(s)
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Type:
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White Paper
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Language:
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English
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ABSTRACT:
Does your data center have the capability to support current and future server, storage, networking, and management technologies? This white paper reviews a modular server enclosure that incorporates the latest advances in power, cooling, I/O, and management technologies. Learn how you can scale your environment for the future and benefit from the following features:
- Redundant and hot-pluggable components for maximum uptime
- Identical and symmetric fabric options B and C for each modular server
- Ethernet I/O switches that provide external I/O flexibility of stacking ports
- A high speed passive midplane that connects the server modules in the front and power, I/O, and management infrastructure in the rear of the enclosure
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Author
John Loffink
Engineer/Strategist
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BROWSE RELATED
RESOURCES
Application Performance Management | Data Center Management | Power Generation Equipment | Server Consolidation | Server Virtualization | Software Configuration Management | User Input Devices
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View All Resources
sponsored by Dell, Inc. and Intel
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